Co-packaged optics for high-performance computing and artificial intelligence

SK hynix has outlined a development roadmap for co-packaged optics in the journal Nature Electronics, aiming to replace traditional electrical connections between processors and memory with high-speed optical signaling. By integrating light-based data transmission directly into chip packages, the company seeks to overcome the bandwidth and energy limitations currently hindering the scaling of large-scale artificial intelligence systems. This transition represents a shift in industry competition from individual chip performance toward the architectural efficiency of entire computing systems.